Semiconix Corporation Competencies DESIGN, is key element in the innovation process. Semiconix Design Center, located in Europe is the main design resource for all Semiconix Businesses. RESEARCH;applied research is conducted in Semiconix Corporation's privately owned research facilities located in Silicon Valley. MANUFACTURING; Semiconix Corporation own wafer fabrication facility has a wide range of capabilities. From in house mask shop to photolithography, epitaxial deposition, diffusion, thin film depositions, test, laser trim, packaging. PACKAGING; Semiconix Corporation businesses are in a favorable position to offer high reliability known good bare die products for MCP and SiP applications as well as CSP and LLP. Semiconix innovative Silicon Printed Circuit Board with Integrated Passive Devices is the coronation of System in Package concept. BARE DIE ASSEMBLIES GREEN PACKAGES LAMINATE CHIP SCALE PACKAGES MULTI CHIP PACKAGES CHIP SCALE PACKAGES IPD ON SILICON PCB LEAD LESS CHIP SCALE PACKAGES SYSTEM IN PACKAGE CHIP ON BOARD KNOWN GOOD DIE LEAD FREE PACKAGES SILICON SYSTEM IN PACKAGE FLIP CHIP KNOWN GOOD BARE DIE MOLDED LEAD FRAME PACKAGES SILICON PRINTED CIRCUIT BOARD Semiconix Corporation is world's single semiconductor manufacturing company that offers high reliability standard semiconductors, sensors and passive devices. In today's extreme miniaturization market, there is no more room for the large packages to protect the die. The bare die has to withstand harsh environment without the protection of a package. Gold interconnection together with well engineered semiconductor and passive devices is the only solution for bare die applications. Semiconix Corporation designs and manufactures standard and custom semiconductor components for medical, wireless telecommunications, computing, military and space applications. Semiconix Semiconductor designs and manufactures analog devices built on semiconductor linear technology. Semiconix Semiconductor Designs and manufactures standard and custom bipolar and MOS analog devices, semiconductors, analog integrated circuits, discrete components for high performance systems such as cellular/wireless, video amplifiers, heart pacemakers and medical imaging systems. Standard semiconductor components are designed and manufactured for space, medical, telecommunications and military applications only. Company's technology road map is including SiGe epi devices for high speed RF bipolars and high speed fiber optic and optoelectronic applications. Analog devices, ASIC analog design and manufacturing: Semiconix produces a series of semi-custom bipolar analog devices in arrays that are customized by designing a specific metal interconnection mask. The arrays contain a large number of undedicated active and passive components, i.e. transistors, diodes, resistors, capacitors, MOSFET s, LDMOS, photodiodes, phototransistors, etc. Since wafers are stocked before the metal mask, the custom IC development phase is shorter and far less expensive compared to conventional full custom ICs. Customers may provide own analog design. Optoelectronic components: photodiodes, photodiodes arrays, phototransistors, position sensing devices, optocouplers, optoisolators, photodarlington, high voltage phototransistors output, Schottky infrared detectors. Discrete semiconductors: Schottky diodes, Zenner diodes, TVS, small signal bipolar transistors, high voltage bipolar transistors, matched pair bipolar transistors, small signal JFET s and MOSFET s, MCT (MOS controlled tyristors), IGBT. Semiconix 's Divisions: HTE Labs Provides Wafer Foundry, R&D support and Specialty Wafer Fab Processing (including thin film vacuum deposition services) to customers from semiconductors and microelectronics industry. Wafer foundry includes the following processes: 20V, 45V, 75V, 25V super-beta and high voltage dielectric isolated bipolar process. R&D support is provided in the following fields of microelectronics: thin film active and passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb), sensor technologies (inertial, pressure, temperature, gas and smoke detectors), optoelectronic technologies and components, discrete and integrated circuits technology development for special applications, LiNbO3 applications like SAW, Ti diffused, light wave guides and Mach-Zender light modulators. Specialty wafer fab processing: epitaxy, SiGe, epi, diffusion and oxidation, ion implant, LPCVD and PECVD Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching, silicon micro-machining by KOH anisotropic etch, sputter depositions of Ti/Ni/Ag lift off process, Ti/Pt/Au lift off process, sputter depositions of thin film resistors : SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by trimetal backside sputter depositions, gold backside sputter depositions and alloy : gold electroplating and gold bump. SEMICONWELL designs and manufacture standard and custom Integrated Passive Networks - IPN for the personal computer, telecommunications, industrial controls, automotive, avionics. The Integrated Passive Networks are a sum of resistors, capacitors, inductors, diodes and schottky diodes and are available in through hole and surface mounted packages. SEMICONWELL is supplying integrated termination, filters and ESD protection for use in mobile phones, PDAs, personal computers, notebooks, routers, hubs, internet appliances. Standard Devices - Most standard devices include resistors, capacitors, inductors, diodes and schottky diodes networks and are inventoried by the designated part numbers and can be ordered on line, from factory or from distributors. Custom Devices - Custom IPN (Integrated Passive Networks) are manufactured from customer's prints upon request. US MICROWAVES develops, manufactures and supplies high quality standard microwave thin film circuits and microwave devices including RF bipolars for hybrid chip and wire applications as follows: microwave thin film circuits, custom manufacturing from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky, PIN, tunnel, SRD, varactor and zero bias diodes, RF NPN and PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe.
 

   
semiconix corporation Semiconix Corporation Competencies
SEMICONIX CORPORATION  

DESIGN - is key element in the innovation process. Semiconix Design Center, located in Europe is the main design resource for all Semiconix Businesses.

RESEARCH - applied research is conducted in Semiconix Corporation's  privately owned research facilities located in Silicon Valley.

MANUFACTURING - Semiconix Corporation own wafer fabrication facility has a wide range of capabilities. From in house mask shop to photolithography, epitaxial deposition, diffusion, thin film depositions, test, laser trim, packaging.

PACKAGING - Semiconix Corporation  businesses are in a favorable position to offer high reliability known good bare die products for  MCP and SiP applications as well as CSP and LLP. Semiconix innovative Silicon Printed Circuit Board with Integrated Passive Devices  is the coronation of  System in Package concept.

GOLD CHIP TECHNOLOGY TM
 
LEAD FREE PACKAGES FLIP CHIP GREEN PACKAGES SYSTEM IN PACKAGE
MOLDED LEAD FRAME PACKAGES CHIP ON BOARD KNOWN GOOD DIE MULTI CHIP PACKAGES
LAMINATE CHIP SCALE PACKAGES BARE DIE ASSEMBLIES IPD ON SILICON PCB SILICON  SYSTEM IN PACKAGE
LEAD LESS CHIP SCALE PACKAGES CHIP SCALE PACKAGES KNOWN GOOD BARE DIE SILICON PRINTED CIRCUIT BOARD

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