SEMICONIX has undertaken the task to redesign and manufacture the future semiconductor components compatible with chip and wire, flip chip, chip scale CSP and surface mount technologies. In today's extreme miniaturization market, there is no more room for the large packages to protect the die. It means that the bare die has to survive on its own without the protection of a package. Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. The solution developed by Semiconix Corporation for known good die for bare die applications is gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix designs and manufactures standard and custom semiconductor components for medical, wireless telecommunications, opto-electronics, computing, military and space applications. Semiconix Semiconductor designs and manufactures analog devices built on semiconductor linear technology. Semiconix Semiconductor Designs and manufactures standard and custom bipolar and MOS analog devices, semiconductors, analog integrated circuits, discrete components for high performance systems such as cellular/wireless, video amplifiers, heart pacemakers and medical imaging systems. Standard semiconductor components are designed and manufactured for space, medical, telecommunications and military applications only. Company's technology road map is including SiGe epi devices for high speed RF bipolars and high speed fiber optic and optoelectronic applications. Analog devices, ASIC analog design and manufacturing: Semiconix produces a series of semi-custom bipolar analog devices in arrays that are customized by designing a specific metal interconnection mask. The arrays contain a large number of undedicated active and passive components, i.e. transistors, diodes, resistors, capacitors, MOSFET s, LDMOS, photodiodes, phototransistors, etc. Since wafers are stocked before the metal mask, the custom IC development phase is shorter and far less expensive compared to conventional full custom ICs. Customers may provide own analog design. Optoelectronic components: photodiodes, photodiodes arrays, phototransistors, position sensing devices, optocouplers, optoisolators, photodarlington, high voltage phototransistors output, Schottky infrared detectors. Discrete semiconductors: Schottky diodes, Zenner diodes, TVS, small signal bipolar transistors, high voltage bipolar transistors, matched pair bipolar transistors, small signal JFET s and MOSFET s, MCT (MOS controlled tyristors), IGBT. Semiconix 's Divisions provides Wafer Foundry, and support and Specialty Wafer Fab Processing (including thin film vacuum deposition services) to customers from semiconductors and microelectronics industry. Wafer foundry includes the following processes: 20V, 45V, 75V, 25V super-beta and high voltage dielectric isolated bipolar process. R&D support is provided in the following fields of microelectronics: thin film active and passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb), sensor technologies (inertial, pressure, temperature, gas and smoke detectors), optoelectronic technologies and components, discrete and integrated circuits technology development for special applications, LiNbO3 applications like SAW, Ti diffused, light wave guides and Mach-Zender light modulators. Specialty wafer fab processing: epitaxy, SiGe, epi, diffusion and oxidation, ion implant, LPCVD and PECVD Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching, silicon micro-machining by KOH anisotropic etch, sputter depositions of Ti/Ni/Ag lift off process, Ti/Pt/Au lift off process, sputter depositions of thin film resistors : SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by trimetal backside sputter depositions, gold backside sputter depositions and alloy : gold electroplating and gold bump. Semiconix designs and manufacture standard and custom Integrated Passive Networks - IPN for the personal computer, telecommunications, industrial controls, automotive, avionics. The Integrated Passive Networks are a sum of resistors, capacitors, inductors, diodes and schottky diodes and are available in through hole and surface mounted packages. Semiconix and its sub-companies supply integrated termination, filters and ESD protection for use in mobile phones, PDAs, personal computers, notebooks, routers, hubs, internet appliances. Standard Devices - Most standard devices include resistors, capacitors, inductors, diodes and schottky diodes networks and are inventoried by the designated part numbers and can be ordered on line, from factory or from distributors. Custom Devices - Custom IPN (Integrated Passive Networks) are manufactured from customer's prints upon request. Our other division develops manufactures and supplies high quality standard microwave thin film circuits and microwave devices including RF bipolars for hybrid chip and wire applications as follows: microwave thin film circuits, custom manufacturing from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky, PIN, tunnel, SRD, varactor and zero bias diodes, RF NPN and PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe.
 

   
semiconix corporation GOLD CHIP TECHNOLOGY™
SEMICONIX CORPORATION  

SEMICONIX has undertaken the task to redesign and manufacture the future semiconductor components compatible with chip and wire, flip chip, chip scale CSP and surface mount technologies. In today's extreme miniaturization market, there is no more room for the large packages to protect the die. It means that the bare die has to survive on its own without the protection of a package. Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. The solution developed by Semiconix Corporation for known good die for bare die applications is gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix designs and manufactures standard and custom semiconductor components for medical, wireless telecommunications, opto-electronics, computing, military and space applications.

ABOUT SEMICONIX HOME EMPLOYMENT OPPORTUNITIES
BUSINESSES NEWS SITE TERMS OF USE
COMPETENCIES CONTACTING SEMICONIX PRIVACY / SECURITY
QUALITY USERS REGISTER - LOG IN SITE SEARCH

SEMICONIX CORPORATION
SEMICONIX CORPORATION
Last updated:Monday, 22-Apr-2013 21:30:06 CDT Display settings for best viewing: Current display settings:
counter Screen resolution: 1124x864 Screen resolution:
  Color quality: 16 bit Color quality: bit
© 1990-Thursday, 30-Jun-2016 14:18:04 CDT SEMICONIX CORPORATION All rights reserved. No material from this site may be used or reproduced without permission.