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Semiconix Corporation Competencies DESIGN, is key element in the innovation process. Semiconix Design Center, located in Europe is the main design resource for all Semiconix Businesses.
RESEARCH;applied research is conducted in Semiconix Corporation's privately owned research facilities located in Silicon Valley.
MANUFACTURING; Semiconix Corporation own wafer fabrication facility has a wide range of capabilities. From in house mask shop to photolithography, epitaxial deposition, diffusion, thin film depositions, test, laser trim, packaging.
PACKAGING; Semiconix Corporation businesses are in a favorable position to offer high reliability known good bare die products for MCP and SiP applications as well as CSP and LLP. Semiconix innovative Silicon Printed Circuit Board with Integrated Passive Devices is the coronation of System in Package concept.
BARE DIE ASSEMBLIES GREEN PACKAGES LAMINATE CHIP SCALE PACKAGES MULTI CHIP PACKAGES
CHIP SCALE PACKAGES IPD ON SILICON PCB LEAD LESS CHIP SCALE PACKAGES SYSTEM IN PACKAGE
CHIP ON BOARD KNOWN GOOD DIE LEAD FREE PACKAGES SILICON SYSTEM IN PACKAGE
FLIP CHIP KNOWN GOOD BARE DIE MOLDED LEAD FRAME PACKAGES SILICON PRINTED CIRCUIT BOARD
Semiconix Corporation is world's single semiconductor manufacturing company that offers
high reliability standard semiconductors, sensors and passive devices. In
today's extreme miniaturization market, there is no more room for the large
packages to protect the die. The bare die has to withstand harsh environment
without the protection of a package. Gold interconnection together with well
engineered semiconductor and passive devices is the only solution for bare die
applications. Semiconix Corporation designs and manufactures standard and custom
semiconductor components for medical, wireless telecommunications, computing,
military and space applications.
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